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Principal/Sr Engineer, Advance Packaging Process Engineering

Posted on Jan. 28, 2026 by Micron Technology

  • nan

Principal/Sr Engineer, Advance Packaging Process Engineering

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron's Assembly Package Technology Development team is looking for a motivated and experienced individual contributor for this position in Process Development team.

Roles & Responsibilities:

  • Developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory from pathfinding through to NPI start up and certification side by side with Manufacturing teams.
  • Assessing processes by knowledge and skills, taking measurements and interpreting data
  • Assembly design rules development working side by side with Design teams (Globally)
  • Involved in the design approvals (Substrate and Silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).
  • Path finding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), WSS (Wafer Support System), photo process and Ball Mount is a plus.
  • Hands-on integration experience in Package Assembly and Wafer Level package process are needed, may need to conduct the supplier interactions/meetings and drive new NDAs with new projects, which all together requires a significant understanding of the processes, first principles and process control systems.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, Physics, or related field.
  • Minimum of 3 years of experience in semiconductor manufacturing or related fields.
  • Proven track record in yield management and driving yield improvement initiatives.
  • Flexibility to support operation including shift -based work and periodic weekend coverage based on critical business needs.
  • Deep understanding of semiconductor manufacturing processes, yield analysis, and statistical process control (SPC).
  • Hands-on experience with data analysis tools such as JMP, or equivalent.
  • Strong communication skills, and able to present complex technical data and trends to leadership and non-technical audiences.
  • Proven ability to work with multi-functional teams and influence partners to achieve strategic goals.
  • Problem-Solving Skills: Strong analytical skills with the ability to troubleshoot and resolve complex technical issues in a high-pressure environment.
  • Project Management: Ability to manage numerous projects simultaneously and prioritize tasks in a fast-paced environment.
  • Cross-Cultural Communication: Experience working with teams across different geographies and cultures.
  • Possess Micron Values: People, Innovation, Tenacity, Collaboration and Customer Focus

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.


Advertised until:
Feb. 27, 2026


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